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| PEP01-5841 Power over ethernet power supply protection Features Peak pulse power: up to 2.7 kW (8/20 s) Stand-off voltage: 58 V 4 unidirectional TransilsTM and 4 decoupling capacitances Low clamping voltage: 100 V Low leakage current: - 0.2 A at 25 C - 1 A at 85 C Operating Tj max: 150 C JEDEC registered package outline Figure 1. Gnd --2-3-6-7 PS1 1 SO-8 package PEP01-5841 Functional diagram PS2 4 PS3 5 PS4 8 Complies with the following standards IEC61000-4-2 level 4 - 15 kV (air discharge) - 8 kV (contact discharge) IEC61000-4-5 level 2 - +/- 1 kV 42 IEEE 802.3af-2003 IEEE 802.3at-2008 Description The PEP01-5841 has been designed to protect power over ethernet PSE equipment against line overvoltages. It embeds 4 decoupling capacititors to stabilize power supplies. It is compatible with IEEE 802.3af-2003 and IEEE 802.3at-2008 requirements and it allows PoE based systems to be protected against both electrical overstress (EOS) and electrostatic discharges (ESD) according to IEC61000-4-5 and IEC61000-4-2. The low clamping voltage (100 V) makes it compatible with PMOS and PSE controller technologies. Developed in Planar technology, it provides high reliability level. Packaged in SO-8, this minimizes PCB consumption (footprint in accordance with the IPC 7531 standard). TM: Transil is a trademark of STMicroelectronics May 2009 Doc ID 15657 Rev 2 1/10 www.st.com 10 Characteristics PEP01-5841 1 Characteristics Table 1. Symbol VPP PPP Tstg Tj TL Absolute ratings (Tamb = 25 C) Parameter Peak pulse voltage (IEC61000-4-2 contact discharge) Peak pulse power dissipation Storage temperature range Operating junction temperature range Maximum lead temperature for soldering during 10 s. Tj initial = Tamb Value 30 2700 -65 to + 150 -55 to + 150 260 Unit kV W C C C Table 2. Symbol VRM VBR VCL IRM IPP T C RD Electrical characteristics definitions(Tamb = 25 C) Parameter Stand-off voltage Breakdown voltage Clamping voltage Leakage current @ VRM Peak pulse current Voltage temperature coefficient Capacitance Dynamic impedance IRM max@VRM VBR @IR (1) min. V 58 V 64.4 67.8 71.2 typ. max. mA 1 max. V 100 A 24 1.2 8/20 s VCL @IPP RD(2) C typ. pF 55 T(3) max. 10-4 C 10.4 Slope = 1/ Rd I PP VCL VBR VRM I RM IR VF V I IF Type 25 C 85 C A PEP01-5841 0.2 A 1 1. Pulse test: tp < 50 ms 2. To calculate maximum clamping voltage at other surge level, use the following formula: VCLmax = RD x IPP + VBRmax 3. To calculate VBR versus junction temperature, use the following formula: VBR @ TJ = VBR @ 25 C x (1 + T x (TJ - 25)) 2/10 Doc ID 15657 Rev 2 PEP01-5841 Figure 2. Pulse waveform % I PP 100 Characteristics Repetitive peak pulse current tr = rise time (s) tp = pulse duration time (s) 50 0 tr tp t Figure 3. Peak power dissipation versus initial junction temperature Figure 4. Peak pulse power versus exponential pulse duration (Tj initial = 25 C) Tj initial = 25 C Ppp[Tj initial] / Ppp [Tj initial = 25C] 110 100 90 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 100.0 PPP (kW) 10.0 1.0 Tj Tj( (C) 150 175 tp (ms) 0.1 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 Figure 5. Clamping voltage versus peak pulse current (exponential waveform, maximum values) Tj initial = 25 C 8/20 s Figure 6. Capacitance versus voltage (typical values) 100.0 IPP (A) 100 C(pF) F=1 MHz VOSC =30 mV rms Tj = 25 C 10.0 1.0 VCL (V) 0.1 70 80 90 100 10 44 46 48 50 52 54 56 VR (V) 58 Doc ID 15657 Rev 2 3/10 Characteristics PEP01-5841 Figure 7. Peak forward voltage drop versus peak forward current (typical values) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration 1.0E+01 IFM (A) 1.00 Zth(j-a) / Rth(j-a) With recommended pad layout 1.0E+00 Tj = 125 C 1.0E-01 Tj = 25 C 0.10 1.0E-02 0.0 0.5 1.0 1.5 2.0 2.5 VFM (V) 3.0 (printed ciruit board FR4, SCU = 1 cm ) 0.01 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 2 tp (s) 1.0E+03 Figure 9. Leakage current versus junction temperature (typical values) 1.E+04 IR(nA) VR = VRM 1.E+03 1.E+02 1.E+01 1.E+00 1.E-01 1.E-02 25 Tj (C) 50 75 100 125 150 4/10 Doc ID 15657 Rev 2 PEP01-5841 Application 2 Application Figure 10. Typical application circuit with PMOS integrated in PSE controller + Tx 48V Rx - IC Tx om Co V1 Rx Gnd PS1 PoE Controller PEP01-5841 PS2 PS3 Tx PS4 Rx Tx Rx Doc ID 15657 Rev 2 5/10 Application Figure 11. Typical application circuit with external PMOS PEP01-5841 PSE controller - 48V Figure 10 and 11 shows typical application schematics of PoE network. Power sourcing equipment (PSE) allows communication and power sourcing for several power devices (PD). The number of ways is generally a multiple of 4, this optimizes the PEP01-5841 for track layout and crosstalk, as well as PCB surface occupation. This protection device has been studied to comply with the latest IEEE 802.3af-2003 requirements and to withstand the surge defined in the IEC 61000-4-5 level 4 requirements. 6/10 Doc ID 15657 Rev 2 PEP01-5841 PEP01-5841 Ordering information scheme 3 Ordering information scheme Figure 12. Ordering information scheme PEP Power over ethernet protection Version Stand off voltage 58 = 58 V 01 - 58 4 1 Number of power supply lines to be protected Packaging 1 = SO-8 Doc ID 15657 Rev 2 7/10 Package information PEP01-5841 4 Package information Case: JEDEC SO-8 molded plastic over planar junction Terminals: solder plated, solderable according to MIL-STD-750, Method 2026 Flammability: epoxy is rated UL94V-0 RoHS package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 3. SO-8 dimensions Dimensions Ref. Seating Plane C A2 A1 A Millimeters Min. Typ. 4.90 6.00 3.90 1.27 1.04 Max. 1.75 0.25 0.48 0.23 5.00 6.20 4.00 0.50 1.27 8 0.10 Min. 0.004 0.049 0.011 0.007 Inches Typ. Max. 0.069 0.010 0.019 0.009 h x 45 A A1 A2 b C D E 0.1 1.25 0.28 0.17 4.80 5.80 3.80 0.25 0.40 0 - C k L b ppp C D e L1 0.189 0.193 0.197 0.228 0.236 0.244 0.150 0.154 0.157 0.010 0.016 0 0.050 0.041 0.020 0.050 8 0.004 8 5 E1 E E1 e h L L1 k ppp 1 4 Figure 13. Footprint recommendations 6.8 (0.268) 0.6 (0.024) 4.2 (0.165) 1.27 (0.050) Figure 14. Marking xxxx x x (R) a z z y ww XXXX: Marking ZZ: Manufacturing location Y: Year WW: week Pin 1 8/10 Doc ID 15657 Rev 2 PEP01-5841 Ordering information 5 Ordering information Table 4. Ordering information Marking 58E1 Package SO-8 Weight 78 mg Base qty 2000 Delivery mode Tape and reel Order code PEP01-5841 6 Revision history Table 5. Date 06-May-2009 14-May-2009 Document revision history Revision 1 2 Initial release. Standards compliance updated. Changes Doc ID 15657 Rev 2 9/10 PEP01-5841 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 Doc ID 15657 Rev 2 |
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